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 MC74AC245, MC74ACT245 Octal Bidirectional Transceiver with 3-State Inputs/Outputs
The MC74AC245/74ACT245 contains eight non-inverting bidirectional buffers with 3-state outputs and is intended for bus-oriented applications. Current sinking capability is 24 mA at both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active-HIGH) enables data from A ports to B ports; Receive (active-LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition.
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PDIP-20 N SUFFIX CASE 738 1
* * * * *
Noninverting Buffers Bidirectional Data Path A and B Outputs Source/Sink 24 mA ACT245 has TTL Compatible Inputs Pb-Free Packages are Available
SOIC-20W DW SUFFIX CASE 751D 1
PIN ASSIGNMENT
PIN OE T/R A0-A7 B0-B7 FUNCTION Output Enable Input Transmit/Receive Input Side A 3-State Inputs or 3-State Outputs Side B 3-State Inputs or 3-State Outputs 1 Outputs 1
TSSOP-20 DT SUFFIX CASE 948E
TRUTH TABLES
Inputs OE L L H T/R L H X
SOEIAJ-20 M SUFFIX CASE 967
ORDERING INFORMATION
Bus B Data to Bus A Bus A Data to Bus B High Z State
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 7 of this data sheet.
VCC 20
OE 19
B0 18
B1 17
B2 16
B3 15
B4 14
B5 13
B6 12
B7 11
1 T/R
2 A0
3 A1
4 A2
5 A3
6 A4
7 A5
8 A6
9 A7
10 GND
Figure 1.
(c) Semiconductor Components Industries, LLC, 2006
1
November, 2006 - Rev. 7
Publication Order Number: MC74AC245/D
MC74AC245, MC74ACT245
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIN IOUT ICC Tstg Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 20 50 50 -65 to +150 Unit V V V mA mA mA C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN, VOUT Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) VCC @ 3.0 V tr, tf Input Rise and Fall Time (Note 1) AC Devices except Schmitt Inputs Input Rise and Fall Time (Note 2) ACT Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current - High Output Current - Low VCC @ 4.5 V VCC @ 5.5 V tr, tf TJ TA IOH IOL VCC @ 4.5 V VCC @ 5.5 V Parameter AC ACT Min 2.0 4.5 0 - - - - - - -40 - - Typ 5.0 5.0 - 150 40 25 10 8.0 - 25 - - Max 6.0 5.5 VCC - - - - ns/V - 140 85 -24 24 C C mA mA ns/V V V Unit
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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MC74AC245, MC74ACT245
DC CHARACTERISTICS
74AC Symbol Parameter VCC (V) TA = +25C Typ VIH Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 VOL Maximum Low Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 IIN IOZT Maximum Input Leakage Current Maximum 3-State Current Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.49 5.49 - - - 0.002 0.001 0.001 - - - - 74AC TA = -40C to +85C Unit Conditions
Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 0.1 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 1.0 V VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 mA V *VIN = VIL or VIH -12 mA IOH -24 mA -24 mA IOUT = 50 mA V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND
VIL
V
VOH
V
V
mA
5.5
-
0.6 - - 8.0
6.0 75 -75 80.0
mA mA mA mA
IOLD IOHD ICC
5.5 5.5 5.5
- - -
*All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms - See AND8277/D at www.onsemi.com)
74AC Symbol Parameter VCC* (V) Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay An to Bn or Bn to An Propagation Delay An to Bn or Bn to An Output Enable Time Output Enable Time Output Disable Time Output Disable Time 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 1.5 1.5 1.5 1.5 2.5 1.5 2.5 1.5 2.0 1.5 2.0 1.5 TA = +25C CL = 50 pF Typ 5.0 3.5 5.0 3.5 7.0 5.0 7.5 5.5 6.5 5.5 7.0 5.5 Max 8.5 6.5 8.5 6.0 11.5 8.5 12.0 9.0 12.0 9.0 11.5 9.0 74AC TA = -40C to +85C CL = 50 pF Min 1.0 1.0 1.0 1.0 2.0 1.0 2.0 1.0 1.0 1.0 1.5 1.0 Max 9.0 7.0 9.0 7.0 12.5 9.0 13.5 9.5 12.5 10.0 13.0 10.0 ns ns ns ns ns ns 3-5 3-5 3-7 3-8 3-7 3-8 Unit Fig. No.
*Voltage Range 3.3 V is 3.3 V 0.3 V. Voltage Range 5.0 V is 5.0 V 0.5 V.
DC CHARACTERISTICS
74ACT Symbol Parameter VCC (V) TA = +25C Typ VIH VIL VOH Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 VOL Maximum Low Level Output Voltage 4.5 5.5 4.5 5.5 IIN DICCT IOZT Maximum Input Leakage Current Additional Max. ICC/Input Maximum 3-State Current Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 1.5 1.5 1.5 1.5 4.49 5.49 - - 0.001 0.001 - - - 0.6 - 74ACT TA = -40C to +85C Unit Conditions
Guaranteed Limits 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 0.1 - 0.6 - - 8.0 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 1.0 1.5 6.0 75 -75 80.0 V V V VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 mA *VIN = VIL or VIH IOH -24 mA -24 mA IOUT = 50 mA *VIN = VIL or VIH 24 mA IOL 24 mA VI = VCC, GND VI = VCC - 2.1 V VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND
V
V
V
mA mA mA mA mA mA
IOLD IOHD ICC
5.5 5.5 5.5
- - -
*All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time.
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4
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms - See AND8277/D at www.onsemi.com)
74ACT Symbol Parameter VCC* (V) Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay, An to Bn or Bn to An Propagation Delay, An to Bn or Bn to An Output Enable Time Output Enable Time Output Disable Time Output Disable Time 5.0 5.0 5.0 5.0 5.0 5.0 1.5 1.5 1.5 1.5 1.5 2.0 TA = +25C CL = 50 pF Typ 4.0 4.0 5.0 5.5 5.5 5.0 Max 7.5 8.0 10 10 10 10 74ACT TA = -40C to +85C CL = 50 pF Min 1.5 1.0 1.5 1.5 1.0 1.5 Max 8.0 9.0 11.0 12.0 11.0 11.0 ns ns ns ns ns ns 3-5 3-5 3-7 3-8 3-7 3-8 Unit Fig. No.
*Voltage Range 5.0 V is 5.0 V 0.5 V.
CAPACITANCE
Symbol CIN CI/O CPD Input Capacitance Input/Output Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 15 45 Unit pF pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V VCC = 5.0 V
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5
MC74AC245, MC74ACT245
ORDERING INFORMATION
Device MC74AC245N MC74AC245NG MC74ACT245N MC74ACT245NG MC74AC245DW MC74AC245DWG MC74AC245DWR2 MC74AC245DWR2G MC74ACT245DW MC74ACT245DWG MC74ACT245DWR2 MC74ACT245DWR2G MC74AC245DT MC74AC245DTG MC74AC245DTR2 MC74AC245DTR2G MC74ACT245DT MC74ACT245DTG MC74ACT245DTR2 MC74ACT245DTR2G MC74AC245M MC74AC245MG MC74AC245MEL MC74AC245MELG MC74ACT245M MC74ACT245MG MC74ACT245MEL MC74ACT245MELG Package PDIP-20 PDIP-20 (Pb-Free) PDIP-20 PDIP-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) 2000 / Tape & Reel 40 Units / Rail 2000 / Tape & Reel 40 Units / Rail 2500 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 75 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail 18 Units / Rail Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb-Free.
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MC74AC245, MC74ACT245
MARKING DIAGRAMS
PDIP-20
SOIC-20W
TSSOP-20
SOEIAJ-20
20 20 MC74AC245N AWLYYWWG 1 1 AC245 AWLYYWWG
20 AC 245 ALYWG G 1
20 74AC245 AWLYWWG 1
20 20 MC74ACT245N AWLYYWWG 1 1 ACT245 AWLYYWWG
20 ACT 245 ALYWG G 1
20 74ACT245 AWLYWWG 1
A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location)
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MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
PDIP-20 N SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E
-A-
20 1 11 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
B
10
C
L
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040
MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
SOIC-20W DW SUFFIX CASE 751D-05 ISSUE G
D
A
11 X 45 _
q
H
M
B
M
20
10X
0.25
E
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
1
10
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
h
18X
e
A1
T
C
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8
L
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
TSSOP-20 DT SUFFIX CASE 948E-02 ISSUE C
K REF
M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 --- --- 0.047 C 1.20 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC -W- H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_
20X
2X
L/2
20
11
J J1 B -U- N
L
PIN 1 IDENT 1 10
0.15 (0.006) T U
S
A -V-
N F DETAIL E
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06 1
16X
0.36
16X
1.26
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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9
IIII IIII IIII
SECTION N-N 0.25 (0.010) M
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
K K1
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
SOEIAJ-20 M SUFFIX CASE 967-01 ISSUE A
20
11
LE Q1 M_ L DETAIL P
E HE
1
10
Z D e VIEW P A
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032
b 0.13 (0.005)
M
A1 0.10 (0.004)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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10
MC74AC245/D


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